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ABP ELECTRONICS LIMITED
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BGA
| Place of Origin: | Guangdong, China (Mainland) |
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Product Detail
Material:FR-4 1.6mm,1OZ copper for each layer
Surface finish: Immersion Gold
Minimum trace width/spacing:5/5mils
Minimum hole Dia.:0.3mm
Character
PCB Technical Capacity
1.Base Materials:High Temperature FR4/FR5,Free halogen FR4,Aluminium Based,Polyimide,Rogers,Arlon ,Other Teflon / PTFE
2.Layers:1-30 layers standard PCB,Cross Blind Vias and Buried Vias Board
2.Layers:1-30 layers standard PCB,Cross Blind Vias and Buried Vias Board
3.Minimum Track Space:3mil/4mil,
4..Maximum Size:1000mm*1200mm
5.Surface Copper Thickness:Maximum:6/6 oz,Minimum:0.5/0.5 oz
6.Hard Gold thickness:Maximum:100U ''
7. Maximum Board Thickness:6.0mm
8.Finishes:SMOBC/HASL,Lead Free SMOBC/HASL,Organic OSP,Hard & Soft Gold,Plating Tin,Immersion Silver,Immersion Tin,Electroless Nickel/Immersion Gold
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Company Info
ABP ELECTRONICS LIMITED [China (Mainland)]
Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
