PCB Technical Capacity
1.Base Materials:High Temperature FR4/FR5,Free halogen FR4,Aluminium Based,Polyimide,Rogers,Arlon ,Other Teflon / PTFE
2.Layers:1-30 layers standard PCB,Cross Blind Vias and Buried Vias Board
3.Minimum Track Space:3mil/4mil,
4..Maximum Size:1000mm*1200mm
5.Surface Copper Thickness:Maximum:6/6 oz,Minimum:0.5/0.5 oz
6.Hard Gold thickness:Maximum:100U ''
7. Maximum Board Thickness:6.0mm
8.Finishes:SMOBC/HASL,Lead Free SMOBC/HASL,Organic OSP,Hard & Soft Gold,Plating Tin,Immersion Silver,Immersion Tin,Electroless Nickel/Immersion Gold